Precision PCBs Engineered for Harsh Environments
From schematic capture to DFM-ready Gerbers — production-grade PCB designs optimised for EMC compliance, thermal stability, and miniaturisation across EV, IoT, solar, and industrial applications.
End-to-End PCB Design Services
From concept to production-ready files, we engineer boards that perform reliably in the field — every time.
At Embed Square, our PCB design practice is built on hands-on hardware engineering across power-dense and signal-integrity-critical applications. Our team handles the complete design chain — requirement analysis, component selection, schematic capture, multi-layer layout, signal integrity simulation, thermal management, and DFM review — ensuring every board is ready for volume manufacturing without costly respins.
Our work spans mixed-signal boards for EV charging stations, low-power IoT sensor nodes, high-voltage solar MPPT controllers, CAN/RS-485 industrial communication boards, ruggedised HMI panels, etc. Whether you need a compact sensor PCB or a complex multi-layer power management board, the same rigour applies throughout: controlled impedance traces, proper ground plane partitioning, EMI suppression, worst-case thermal analysis, etc. — all documented in a complete manufacturing handoff package.
Signal Integrity First
Every high-speed trace — DDR, USB, Ethernet, RF — is length-matched, impedance-controlled, and field-solver verified before layout is finalised.
Power-Dense Layouts
From 3.3 V MCU rails to 800 V EV charger bus architectures — copper pours sized for real thermal loads, not best-case estimates.
DFM & DFT by Default
Design for Manufacturability and Design for Testability constraints are embedded from day one, reducing assembly defect rates and enabling efficient in-circuit testing.
PCB Design Capabilities
A full-spectrum capability set covering every PCB technology your product demands.
Schematic Capture & Netlist Management
Hierarchical schematics authored in KiCad 8 and Altium Designer. Every net is annotated, cross-referenced, and validated against component datasheets before layout begins.
- Custom component library with IPC-7351 verified footprints
- Electrical Rules Check — zero unresolved violations before layout
- BOM generation with Mouser/DigiKey real-time cross-reference
- Multi-sheet hierarchical and flat schematic support
Multi-Layer PCB Layout
Structured stack-up planning for EMI containment, power delivery, and signal integrity. We handle 1–16 layer boards with controlled impedance requirements.
- Controlled impedance: 50 Ω, 75 Ω, 100 Ω differential pairs
- HDI with blind, buried, and via-in-pad structures
- Ground plane stitching and split-plane management
- Back-drill for high-speed stub elimination
RF & Wireless PCB Design
Antenna placement, impedance matching, and keep-out zone enforcement for BLE, Wi-Fi, LoRa, Zigbee, and cellular modules used in IoT gateways and sensor nodes.
- 50 Ω coplanar waveguide and microstrip RF routing
- Antenna keep-out zone and ground clearance enforcement
- π-network impedance matching circuit layout
- Shielding can footprints and ground stitch via rings
Power Electronics Design
High-current and high-voltage PCB layouts for SMPS, motor drives, EV charging modules, and solar inverter boards where switching noise and thermal dissipation demand specialist techniques.
- Wide copper pours and polygon fills for >10 A current paths
- GaN and SiC MOSFET thermal relief and gate drive layout
- Low-parasitic-inductance snubber circuit routing
- IEC 60950 / IEC 62368 creepage and clearance compliance
Thermal Analysis & Management
Simulation-backed thermal analysis to identify hot spots and design effective heat-spreading strategies before prototypes are ordered.
- JEDEC junction-to-board thermal resistance modelling
- Thermal via array design under QFN and BGA packages
- Copper coin and embedded heatsink integration
- Operating temperature derating analysis for −40 °C to +85 °C
DFM, DFT & Manufacturing Handoff
Every design exits our studio with a zero-ambiguity manufacturing package reviewed against fabrication and assembly house capabilities.
- Gerber RS-274X, ODB++, and IPC-2581 output formats
- Assembly drawings with reference designators and polarity callouts
- Test point placement for bed-of-nails and flying probe fixtures
- Panelisation with V-score and tab-routing specifications
Our PCB Design Process
A structured, milestone-driven workflow that keeps your project on schedule and on-spec from brief to board.
Requirements & Architecture Review
Deep-dive into supply voltages, communication interfaces, operating environment, regulatory targets, and volume roadmap. Every design decision is shaped here — preventing late-stage pivots.
Component Selection & BOM Strategy
Components selected for performance, supply chain availability, lead time, and cost — with second-source alternatives identified upfront. End-of-life and allocation-risk parts flagged before they become production blockers.
Schematic Capture & Design Review
Hierarchical schematics drawn, ERC-verified, and reviewed against datasheet application circuits, power sequencing requirements, and interface voltage compatibility. Formal design review gate before layout.
PCB Layout & Signal Integrity
Component placement optimised for signal flow and thermal performance. Critical high-speed and power nets routed first. Impedance-controlled traces verified against the stack-up calculator.
DRC, DFM & Simulation Review
Design Rule Check confirms spacing, annular ring, and via constraints. DFM report flags features outside fabricator process window. Thermal and power integrity simulations validate real-world performance margins.
Manufacturing Package & Prototype Support
Complete Gerber package, assembly drawings, pick-and-place centroid files, stencil aperture data, and test point list generated. During prototype bring-up, engineers remain available for debugging and any post-prototype revision.
Why Our PCB Designs Perform
Engineering principles and quality controls that separate production-proven boards from prototype-quality designs.
Impedance-Controlled Routing
SI VerifiedEvery high-speed interface — USB 2.0/3.0, SDIO, RMII Ethernet, DDR SDRAM, LVDS — is routed with precise trace-width and spacing calculated from the confirmed stack-up and dielectric constant. We use field solvers to validate characteristic impedance before Gerber release, eliminating reflections, crosstalk, and signal degradation that cause intermittent field failures.
EMC-Conscious Design Practice
EMC CompliantWe treat EMC compliance as a layout discipline, not an afterthought. Return current path continuity is maintained under every high-frequency trace. Decoupling capacitors placed within 0.5 mm of power pins with minimised loop inductance. Clock signals routed away from I/O connectors. This approach significantly reduces EMC test iterations required before CE or FCC certification.
IPC Standards Adherence
IPC-2221 CompliantAll designs authored to IPC-2221 generic PCB design standards, IPC-7351 for SMT land pattern design, and IPC-A-600 acceptability criteria. Footprint libraries built from first principles against manufacturer land pattern recommendations and IPC calculator outputs — not copied from unverified community sources. This gives fabrication and assembly partners high-confidence input data.
Zero-Ambiguity Handoff Package
Production-ReadyWe do not consider a design complete until every manufacturing stakeholder has unambiguous inputs. Handoff includes Gerber RS-274X, ODB++ archive, IPC-D-356A netlist for electrical test, pick-and-place centroid in CSV and XML, assembly drawing with all polarity callouts, and RoHS material declaration. Optional: 3D STEP models and IPC-2581 for advanced DFM tools.
Industries We Design PCBs For
Sector-specific design expertise built from real product deployments across India and global OEM supply chains.
EV Charging Infrastructure
High-voltage EVSE controller boards, DC fast charger power modules, and CCS2/CHAdeMO communication interface PCBs rated for outdoor enclosures.
Industrial IoT & Edge Computing
Multi-protocol IoT gateway PCBs, LoRa sensor nodes with energy harvesting, and RS-485/Modbus RTU edge interface boards for factory and field deployments.
Solar Energy & Renewables
Solar MPPT charge controller PCBs, string-level monitoring units, and grid-tie inverter gate drive and protection boards engineered for outdoor thermal cycling.
HMI & Industrial Control Panels
Capacitive touch HMI mainboards, modular DIN-rail I/O backplanes, and industrial panel PC carrier boards built for IP65-rated enclosures.
Industrial Automation & Motor Drives
3-phase BLDC motor drive control PCBs, isolated 4–20 mA analog input conditioning boards, and PLC digital I/O expansion modules with robust noise immunity.
Workforce & Facility Management
Fingerprint + RFID attendance terminal PCBs, cellular-connected access control boards, and facial recognition edge processing modules for plant and site deployments.
Why Engineering Teams Choose Embed Square
Real technical depth, not a design bureau that outsources your IP to junior contractors.
Hardware Engineers, Not CAD Operators
Our PCB designers are embedded systems engineers first — they have designed, assembled, and debugged the boards they lay out. Layout decisions are informed by bring-up experience: proper test point placement, debugger connector accessibility, and fail-safe reset circuit topology are considered at the layout stage, not discovered during prototype bring-up.
Full Ownership Across the Hardware Stack
Embed Square covers firmware, mechanical enclosure integration, and production liaison alongside PCB design. Signal interfaces are validated against real firmware driver constraints. Connector placement is checked against the enclosure 3D model. Production queries are answered by the same team that designed the board — no translation losses.
Local to India's Manufacturing Ecosystem
Based in Pune, we have established working relationships with PCB fabricators and SMT assembly houses across Maharashtra, Gujarat, Bengaluru, and Chennai. We understand local process capabilities, MOQ realities, and import-substitute component availability — translating directly into faster prototype cycles and lower NPI costs.
Transparent, Milestone-Based Delivery
Fixed-milestone contracts with defined deliverables at each stage — no ambiguous hourly billing. Each milestone has a formal client review gate before the next phase is authorised. Design files, simulation reports, and manufacturing packages are versioned and shared via a dedicated project workspace.
Ready to Take Your Hardware from Schematic to Silicon?
Share your product brief and receive a detailed scope, timeline, and fixed-price proposal within 48 hours.